September 13, 2019
Join us on our booth at the 22nd Microelectronics & Packaging Conference & Exhibition (EMPC) in Conference Center of Pisa, Italy from September 16-19, 2019.
"This year’s conference program promises an exciting mix of presentations from all areas of microelectronics...
August 30, 2019
Many thanks to "La Meuse" for this article.
August 26, 2019
We are proud to announce the publication of an article about Taipro in the Belgian newspaper L'Echo.
Please find below the link to this article :
PDF version here
December 12, 2018
The European Regional Development Fund and Wallonia Invest In Your Future
Taipro Engineering is proud to announce its contribution to the "Heliot Project" in partnership with Thales Alenia Space in Belgium and with the support of the European Regional Development Fund a...
September 11, 2018
Taipro Engineering SA is proud to announce the partnership signed with Light Avenue GmbH.
Thanks to this new partnership Taipro becomes Light Avenue GmbH's distributor of bare die and SMD LED for the Belgian and French market.
You can now dream on your best lighti...
April 30, 2018
Join us on Taipro Engineering's booth at ENOVA Toulouse on May 30th and 31st 2018.
On the program numerous exhibitors, visitors and conferences in the field of electronics, measurement, vision and optics technologies.
Looking forward to seeing...
December 20, 2017
Taipro Engineering welcomes you to the "Micro & Nano Electronics Packaging, Assembly, & Design Forum 2018"(MiNaPAD2018) May 16th & 17th 2018 in the Grenoble WTC congress center.
On the agenda many exhibitors and conferences in the field of micro and nano electroni...
The whole Taipro Engineering's Team thanks you for this past year and wishes you a Merry Christmas and a Happy New Year 2018 !
Taipro Engineering will be closed for the Christmas Holidays from December 25th to January 1st.
We are looking forward to starti...
August 1, 2017
Taipro Engineering invites you to its event organized to celebrate our business development in France.
On the agenda, an intervention of Olivier Guiller, R&D engineer at CMP, about packaging and microassembly stakes and issues for microelectronics designers.