Partnership launch between Smart Equipment Technology (SET) & Taipro Engineering
As the world’s leading supplier of high precision flip-chip bonders, SET begins a collaboration with Taipro Engineering, based in...
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News
Join us at EMPC2019 in PISA
Join us on our booth at the 22nd Microelectronics & Packaging Conference & Exhibition (EMPC) in Conference Center of Pisa, Italy from...
They talk about us in the newspapers !
Many thanks to "La Meuse" for this article.
TAIPRO is in the news !
We are proud to announce the publication of an article about Taipro in the Belgian newspaper L'Echo. Please find below the link to this...
New packaging services at Taipro Engineering
The European Regional Development Fund and Wallonia Invest In Your Future Taipro Engineering is proud to announce its contribution to the...
Taipro's new partnership with Light Avenue GmbH
Taipro Engineering SA is proud to announce the partnership signed with Light Avenue GmbH. Thanks to this new partnership Taipro becomes...
Come and visit us at ENOVA 2018, Toulouse
Join us on Taipro Engineering's booth at ENOVA Toulouse on May 30th and 31st 2018. On the program numerous exhibitors, visitors and...
Meet Taipro Engineering in MINAPAD2018, Grenoble
Taipro Engineering welcomes you to the "Micro & Nano Electronics Packaging, Assembly, & Design Forum 2018"(MiNaPAD2018) May 16th & 17th...
Christmas Holidays' closing
The whole Taipro Engineering's Team thanks you for this past year and wishes you a Merry Christmas and a Happy New Year 2018 ! Taipro...
Event to celebrate Taipro Engineering's business development in France
Taipro Engineering invites you to its event organized to celebrate our business development in France. On the agenda, an intervention...
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