top of page

Thanks to our experienced team and our clean room class 10000 with automatic bonding and pick and place machines we are able to provide you reliable and tailored back-end solutions from prototypes to production.

P-Standard

Standard Packaging

​​

  • Standard open cavity package :

    • QFN, DIL, JLCC, ... 

  • Wire bonding:

    • Wedge & Ball bonding

    • Au, Al

  • Encapsulation

  • Laser marking

  • Pull & Shear tests

​

​

​

Any request ? Please contact us

P-Advanced

Advanced Packaging

  • ​Substrate design

  • Custom subtrate material:

    • FR4, Rogers, IMS, Flex, Ceramic, ...

  • Bonding:

    • Ultra fine pitch down to 50µm

    • Low loop

    • Challenging wirebonding 

  • Stacking​​​

  • Flip-chip (ACCµRA M)

  • ACA ( Anisotropic Conductive Adhesive)  

  • Applications:

    • ASIC, Image sensor, IR sensor, MEMS, ...

​

Any request ? Please contact us

P-CoB

Chip-on-Board

  • Substrate design

  • Substrates:

    • FR4, Rogers, IMS, Flex, Ceramic, ...​

  • System-in-Package (SiP)

  • Hybrid electronics : Assembly of bare dies and SMD components on the same board

  • Multi-Chip-Module (MCM)

  • Flip-chip

  • BGA

  • Solder paste & Glue dispensing

  • TH soldering

  • Reflow under inert gas

  • SMD components assembly

  • RoHS processes

  • Laser marking

  • Tests 

​

Any request? Please contact us 

bottom of page