Thanks to our experienced team and our clean room class 10000 with automatic bonding and pick and place machines we are able to provide you reliable and tailored back-end solutions from prototypes to production.

 

Standard Packaging

  • Standard open cavity package :

    • QFN, DIL, JLCC, ... 

  • Wire bonding:

    • Wedge & Ball bonding

    • Au, Al

  • Encapsulation

  • Laser marking

  • Pull & Shear tests

Any request ? Please contact us

 

Advanced Packaging

  • Substrate design

  • Custom subtrate material:

    • FR4, Rogers, IMS, Flex, Ceramic, ...

  • Bonding:

    • Ultra fine pitch down to 50µm

    • Low loop

    • Challenging wirebonding 

  • Stacking​​

  • Flip-chip

  • ACA ( Anisotropic Conductive Adhesive) 

  • Hermetic sealing 

  • Applications:

    • ASIC, Image sensor, IR sensor, MEMS, ...

Any request ? Please contact us

 

Chip-on-Board

  • Substrate design

  • Substrates:

    • FR4, Rogers, IMS, Flex, Ceramic, ...​

  • System-in-Package (SiP)

  • Hybrid electronics : Assembly of bare dies and SMD components on the same board

  • Multi-Chip-Module (MCM)

  • Flip-chip

  • BGA

  • Solder paste & Glue dispensing

  • TH soldering

  • Reflow under inert gas

  • SMD components assembly

  • RoHS processes

  • Laser marking

  • Tests 

Any request? Please contact us 

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Taipro Engineering SA

sales@taipro.be

+32.4.353.30.10

15/1 Rue Bois Saint-Jean

BE 4102 Seraing, Belgium

Tailored microsystems improving your Product