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Partnership launch between Smart Equipment Technology (SET) & Taipro Engineering

As the world’s leading supplier of high precision flip-chip bonders, SET begins a collaboration with Taipro Engineering, based in Verviers, Belgium. TAIPRO produces and markets micro-electronic systems worldwide. The world’s smallest pressure sensor is developed by TAIPRO. The objective of this partnership: to offer flip-chip bonding tests and services to Benelux (Belgium, the Netherlands, and Luxembourg) customers and to develop new markets.

Use of an ACCμRA M Flip-chip bonding is a component assembly technology used in high-precision, high-density electronic connections. The first demonstration machine, installed by SET in the TAIPRO ENGINEERING clean room is an ACCμRA M. This easy to use Flip-Chip bonder is popular with research centres and universities. It allows manual alignment and assembly of components with an accuracy of 3 μm.

SET, an international employee owned company With several hundred Flip-Chip bonders used in clean rooms around the world, SET is a recognized international leader in its market. This French company founded in 1975, has the distinction of being employee owned since 2012.

TAIPRO at the wheel Based in Verviers, Belgium TAIPRO ENGINEERING assembles its customer’s components, either as prototyping or production. As a micro-manufacturing specialist, TAIPRO will also receive SET customers who need other micro-manufacturing services that TAIPRO offers (stud bumping, shear test, etc.).

A bigger footprint in the European market Located in the heart of Europe, this new demonstration centre is designed for customers in the Benelux region. “It responds to a growing demand for ultra-precise component assembly equipment for research in Europe.”, said Pascal Metzger, SET CEO.

“It also responds to a need, on the one hand for an increasing miniaturization of components and on the other to mix different micro-assembly techniques to obtain innovative and robust solutions for very demanding environments. This is a unique opportunity to open up to these new markets.”, said Michel Saint-Mard, Managing Director of TAIPRO ENGINEERING.

ACCµRA M Flip-chip bonder from SET SAS


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