Join us at EMPC2025, Grenoble - September 16 – 18, 2025

Taipro Engineering will participate in the European Microelectronics and Packaging Conference (EMPC 2025).

Visit us at booth 36 to discover our expertise and discuss your projects — our specialists will be happy to answer any of your questions.

EMPC 2025 is a European event that brings together researchers, innovators, and industry experts to discuss the latest trends, challenges, and solutions in semiconductor packaging.

We look forward to welcoming you there!

The Taipro Engineering Team