Join us at EMPC2019 in PISA


Join us on our booth at the 22nd Microelectronics & Packaging Conference & Exhibition (EMPC) in Conference Center of Pisa, Italy from September 16-19, 2019.

"This year’s conference program promises an exciting mix of presentations from all areas of microelectronics and photonics packaging and interconnection technologies. With distinguished representatives from science and industry as keynote speakers at EMPC-2019, who will highlight different aspects of electronics technologies and applications of considerable interest to engineers and scientists."

More info at : http://www.empc2019.org/home-page-it.html​ [if !supportLineBreakNewLine] [endif]

#EMPC2019 #ICPackaging #TaiproEngineering #Microelectronics