Join us on our booth at the 22nd Microelectronics & Packaging Conference & Exhibition (EMPC) in Conference Center of Pisa, Italy from September 16-19, 2019. "This year’s conference program promises an exciting mix of presentations from all areas of microelectronics and photonics packaging and interconnection technologies. With distinguished representatives from science and industry as keynote speakers at EMPC-2019, who will highlight different aspects of electronics technolog
The European Regional Development Fund and Wallonia Invest In Your Future Taipro Engineering is proud to announce its contribution to the "Heliot Project" in partnership with Thales Alenia Space in Belgium and with the support of the European Regional Development Fund and Wallonia. This project allows Taipro Engineering to increase its knowledge and packaging services using new technologies such as: Heavy wire bonding Pull & Shear test Hermetic seam sealing X-ray inspection h
Taipro Engineering welcomes you to the "Micro & Nano Electronics Packaging, Assembly, & Design Forum 2018"(MiNaPAD2018) May 16th & 17th 2018 in the Grenoble WTC congress center.
On the agenda many exhibitors and conferences in the field of micro and nano electronics.
We are looking forward to meeting you on our booth to present our last realizations related to: Design: Turnkey electronics and microelectronics engineering projects Packaging: Microassembly and encapsulation
Taipro Engineering invites you to its event organized to celebrate our business development in France.
On the agenda, an intervention of Olivier Guiller, R&D engineer at CMP, about packaging and microassembly stakes and issues for microelectronics designers.
After that, Thibault Lioret, business developer, will present the different packaging technologies as well as the offer of Taipro Engineering in this field.
Finally we will end with a drink to allow everyone to discu