Meet Taipro Engineering in MINAPAD2018, Grenoble
Taipro Engineering welcomes you to the "Micro & Nano Electronics Packaging, Assembly, & Design Forum 2018"(MiNaPAD2018) May 16th & 17th 2018 in the Grenoble WTC congress center. On the agenda many exhibitors and conferences in the field of micro and nano electronics. We are looking forward to meeting you on our booth to present our last realizations related to:
Design: Turnkey electronics and microelectronics engineering projects
Packaging: Microassembly and encapsulation services from standard electronics to custom specific packages
Website of the event: http://france.imapseurope.org/index.php/event-main/minapad-2018/
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