Taipro Engineering welcomes you to the "Micro & Nano Electronics Packaging, Assembly, & Design Forum 2018"(MiNaPAD2018) May 16th & 17th 2018 in the Grenoble WTC congress center.
On the agenda many exhibitors and conferences in the field of micro and nano electronics.
We are looking forward to meeting you on our booth to present our last realizations related to: Design: Turnkey electronics and microelectronics engineering projects Packaging: Microassembly and encapsulation
Taipro Engineering invites you to its event organized to celebrate our business development in France.
On the agenda, an intervention of Olivier Guiller, R&D engineer at CMP, about packaging and microassembly stakes and issues for microelectronics designers.
After that, Thibault Lioret, business developer, will present the different packaging technologies as well as the offer of Taipro Engineering in this field.
Finally we will end with a drink to allow everyone to discu