Join us at EMPC2019 in PISA

September 13, 2019


Join us on our booth at the 22nd Microelectronics & Packaging Conference & Exhibition (EMPC) in Conference Center of Pisa, Italy from September 16-19, 2019.


"This year’s conference program promises an exciting mix of presentations from all areas of microelectronics and photonics packaging and interconnection technologies. With distinguished representatives from science and industry as keynote speakers at EMPC-2019, who will highlight different aspects of electronics technologies and applications of considerable interest to engineers and scientists."


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Taipro Engineering SA


15/1 Rue Bois Saint-Jean

BE 4102 Seraing, Belgium

Tailored microsystems improving your Product