The European Regional Development Fund and Wallonia Invest In Your Future Taipro Engineering is proud to announce its contribution to the "Heliot Project" in partnership with Thales Alenia Space in Belgium and with the support of the European Regional Development Fund and Wallonia. This project allows Taipro Engineering to increase its knowledge and packaging services using new technologies such as: Heavy wire bonding Pull & Shear test Hermetic seam sealing X-ray inspection h
Join us on Taipro Engineering's booth at ENOVA Toulouse on May 30th and 31st 2018. On the program numerous exhibitors, visitors and conferences in the field of electronics, measurement, vision and optics technologies. http://www.enova-event.com/ Looking forward to seeing you there ! #packaging #Microassembly #Microsystems #MEMS #Microelectronics #Sensors #Instrumentation #EMS #ElectronicEngineering #Microsystemdesign #Advancedpackaging #ElectronicMeasurement
Taipro Engineering welcomes you to the "Micro & Nano Electronics Packaging, Assembly, & Design Forum 2018"(MiNaPAD2018) May 16th & 17th 2018 in the Grenoble WTC congress center.
On the agenda many exhibitors and conferences in the field of micro and nano electronics.
We are looking forward to meeting you on our booth to present our last realizations related to: Design: Turnkey electronics and microelectronics engineering projects Packaging: Microassembly and encapsulation
The whole Taipro Engineering's Team thanks you for this past year and wishes you a Merry Christmas and a Happy New Year 2018 ! Taipro Engineering will be closed for the Christmas Holidays from December 25th to January 1st. We are looking forward to starting a prosperous new year by your side #LEDMicroelectronic #LEDlighting #LEDwirebonding #LEDlightingsolution #ElectronicEngineering #EMS #Microassembly #AdvancedPackaging #Wirebonding #Chiponboardassemblyservices #Microsystems
Taipro Engineering invites you to its event organized to celebrate our business development in France.
On the agenda, an intervention of Olivier Guiller, R&D engineer at CMP, about packaging and microassembly stakes and issues for microelectronics designers.
After that, Thibault Lioret, business developer, will present the different packaging technologies as well as the offer of Taipro Engineering in this field.
Finally we will end with a drink to allow everyone to discu