Taipro Engineering invites you to its event organized to celebrate our business development in France.
On the agenda, an intervention of Olivier Guiller, R&D engineer at CMP, about packaging and microassembly stakes and issues for microelectronics designers.
After that, Thibault Lioret, business developer, will present the different packaging technologies as well as the offer of Taipro Engineering in this field.
Finally we will end with a drink to allow everyone to discuss freely.
This event will be held on Thursday, August 31st from 5 pm at the AEPI's premises:
Please confirm your participation by email to the following adress: email@example.com
If you want to invite other people to this event do not hesitate, just let us know by e-mail.
Looking forward to meeting you on this event.
See you soon!