Products and Services

The proposed offer of TAIPRO Engineering is essentially a supply of engineering services with high added value intended to integrate microsystems in industrial products or processes, in order to solve problems or to bring new features to products.
In the first phase of project development, service delivery has 3 main axes:
  • Services in packaging and microassembly, generally for the microelectronics industry (including both interconnection and packaging): feasibility study, packaging choice guidance, testing and demonstration;
  • "Turnkey" complete realization of projects based on a functional specification (for areas not related to microelectronics): feasibility study - prototype / demonstrator - small series (20 - 100 pieces);
  • Possibility of training on high-technology specific equipment of the Microsys laboratory
In terms of available equipment, TAIPRO Engineering uses the following advanced technologies:
  • About 12 machines specifically dedicated to packaging with their most used tools (mainly manual/semi-automatic equipments with programmable parameters).
  • Accredited clean room (200 m² for internal use, including 30 m² reserved for rental to industrials).
These highly versatile equipments can assemble, interconnect, package and test a wide range of microsystems and mechanical microassemblies. In particular, the following techniques are available (also see the list of equipment in image):
  • 6’’ wafer scribing,
  • Plasma cleaning before assembly
  • Assembly of the chip and its substrate by gluing (die attach, pick & place, flip chip),
  • Interconnection by ultrasonic wire bonding,
  • Bonds & die attach characterization (wire pull, ball & die shear test),
  • Encapsulation of microsystems (potting, globe top, hermetic seam sealing),
  • Gold plating, machining of PCB tracks.